In this connectivity module collaboration, Intel will take care of platform design, software, integration and support as well as sales and marketing. Nokia, for its part, will bring its expertise in HSDPA, connectivity products and carrier relationships. Nokia will also manufacture the module.
Delivery will be the responsibility of Intel Corporation which will supply notebook manufacturers as part of its next-generation Intel Centrino Duo mobile technology platform. The connectivity module will be widely available as an embedded option in a variety of notebooks.
One aspect of bringing an HSDPA connectivity module to notebooks is the fact that 3G is the fast wireless broadband technology available for consumers in many countries on different continents. Nokia is a firm believer that 3G connectivity will develop into a strong wireless wide-area network mobile connectivity option for notebook computers.
?Notebook users are increasingly interested in wireless broadband access, and 3G offers a strong solution that is available today," in the opinion of Mooly Eden, Vice-President and General Manager of Intel's Mobile Platforms Group. "This module complements Intel's Wi-Fi and WiMax solutions to offer expanded connectivity options for notebook users."
Combining HSDPA cellular connectivity with other wireless technologies in notebook computers enables users to easily choose the best radio connection and use their notebooks with a seamless connectivity through wireless networks. Multi-radio notebooks also open up new opportunities for operators for providing new innovative easy-to-access mobile solutions.