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Infineon launches next-generation ultra-low-cost mobile phone chips

Infineon Technologies has announced its third generation of ultra-low-cost (ULC) mobile phone chips. The X-Gold110 is claimed by Infineon to be a very cost effective one-chip solution for GSM/GPRS ultra-low-cost phones. System costs (bill-of-material) for mobile phone manufacturers are said to be 20 per cent lower compared to existing solutions.

"We are very proud to successfully introduce our third generation ULC solution", says Weng Kuan Tan, Division President for the Wireless Solutions Division at Infineon. "We see an ever-growing demand in the ultra-low-cost and entryphone segment. Our solutions...serve the needs of network operators and mobile phone manufacturers who are offering their services in emerging markets, where cost efficient solutions are the most important criteria to serve the mainly lower income population. With our solutions, we enable the people in these regions to participate in the economic progress of their countries by making low cost mobile communication a reality."

The X-Gold110 is the heart of Infineon's mobile phone platform XMM1100, offering optimised functionalities on a small footprint four-layer-PCB. The new platform supports colour display, mp3 playback, FM Radio, USB charging and is prepared for Dual-Sim and camera solutions.

The XMM1100 helps to shorten internal research cycles at the phone manufacturers from more than one year to three-tofour-month, due to the high amount of know-how integrated in the platform and the almost "plug-and-play" qualification. It furthermore optimises production cycles by reduced component count from 200 to 50. Samples of the X-Gold110 and the XMM1100 will be available in Q209. Volume production starts in the second half of this year.

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